G06900 - SEMI G69 - Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds StdTpc-Statistical Control This Document defines relation with

This Document defines relation with main part of SEMI E54 including Common Device Model (CDM) and existing Specific Device Models (SDMs)

This Document applies only to hydrogen gas delivered through pipelines

SEMI M49 — Guide for Specifying Geometry Measurement Systems for Silicon Wafers for the 130 nm to 22 nm Technology Generation

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G06900 - SEMI G69 - Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds StdTpc-Statistical Control This Document defines relation withThis Standard describes procedures for measuring adhesive strength between leadframes and molding compounds for semiconductor packages. The procedures include shear test, pull test, and three point bending techniques. This Standard may be used on all types of semiconductor leadframe and molding compound. The methods help leadframe manufacturers, molding compound manufacturers and their customers in evaluating leadframes, and molding compounds as a