E18500 - SEMI E185 - Specification for 300 mm Tape Frame FOUP StdTpc-Automation Technology Two test methods are covered

Two test methods are covered as follows:

previously published November 2004

and materials use in SME in order to promote efficiency

which define the properties of the substrate and the epitaxial layer

and unambiguously

E18500 - SEMI E185 - Specification for 300 mm Tape Frame FOUP StdTpc-Automation Technology Two test methods are covered1 Purpose 1. 1 The purpose of this Specification is to establish basic physical dimensions for the Tape Frame FOUP which is intended to be used to transport and store 300 mm tape frames, as specified by SEMI G74 and SEMI G87, within IC manufacturing facilities. 2 Scope 2. 1 This Standard specifies the external features and dimensions of the Tape Frame FOUP. 2. 2 This Standard specifies the internal dimensions for storing the tape frames in the Tape