G08600 - SEMI G86 - Test Method for Measurement of Chip (Die) Strength by Mean of 3-Point Bending Revision:SEMI G86-0217 - Superseded orgで入手可能となる。初版は1999年発行。前版は2005年3月発行。

orgで入手可能となる。初版は1999年発行。前版は2005年3月発行。

The GEM Standard defines which SECS-II messages should be used

the user must be specific in the selection of the tube and welded fitting s to be evaluated

SEMI E99-1104E (editorial revision)

1  The purpose of this Standard is to standardize requirements for ammonium hydroxide used in the semiconductor industry and testing procedures to support those standards

G08600 - SEMI G86 - Test Method for Measurement of Chip (Die) Strength by Mean of 3-Point Bending Revision:SEMI G86-0217 - Superseded orgで入手可能となる。初版は1999年発行。前版は2005年3月発行。This Test Method defines a procedure for the evaluation of die strength by the mean of 3 point bending method. This Test Method applies only for 3 point bending method, and other methods will be defined by the separate documents. This Test Method is used to measure die strength for dies from processed wafers. Wafer thinning technology becomes popular to meet the demand for thin packages, so the die strength data is critical for the die quality and