P02700 - SEMI P27 - Parameter Checklist for Resist Thickness Measurement on a Substrate StdPbc-0220 表面に存在する静電気電荷は，半導体製造環境の中で多くの望ましくない効果を引き起こす｡

表面に存在する静電気電荷は，半導体製造環境の中で多くの望ましくない効果を引き起こす｡

This Guide can be used as a guide by semiconductor manufacturers and cleanroom facilities designers during the design of their facilities

SEMI E87-0301 (technical revision)

SEMI MF95-1107 (technical revision)

an automated approach to fabrication of suitable test structures using standard tools available in modern wafer fabs

P02700 - SEMI P27 - Parameter Checklist for Resist Thickness Measurement on a Substrate StdPbc-0220 表面に存在する静電気電荷は，半導体製造環境の中で多くの望ましくない効果を引き起こす｡This checklist was technically approved by the Global Micropatterning Committee and is the direct responsibility of the Japanese Micropatterning Committee. Current edition approved by the Japanese Regional Standards Committee on April 28, 2003. Initially available at www. semi. org June 2003; to be published July 2003. Originally published in 1996. NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain