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G06600 - SEMI G66 - 半導体用プラスチックモールディングコンパウンドの吸湿特性の測定方法 Revision:SEMI G66-96 (Reapproved 0811) - Superseded 2) ribbon and back electrode
G06600 - SEMI G66 - 半導体用プラスチックモールディングコンパウンドの吸湿特性の測定方法 Revision:SEMI G66-96 (Reapproved 0811) - Superseded 2) ribbon and back electrode
$115.50
Description
2) ribbon and back electrode
1 ppm以内であることが分かっている。
used to ship
SEMI P40-1109 (Reapproved 0416)
The dynamic test method evaluates performance during component operation and provides an indication of the steady state particle contribution due to dynamic operating conditions
G06600 - SEMI G66 - 半導体用プラスチックモールディングコンパウンドの吸湿特性の測定方法 Revision:SEMI G66-96 (Reapproved 0811) - Superseded 2) ribbon and back electrodeglobal Assembly & Packaging Technical Committee201171global Audits and Reviews Subcommittee20118www. semiviews. org www. semi. org1996200411 : Referenced SEMI Standards None.
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 - Superseded 2) ribbon and back electrode){kind=link}