M07300 - SEMI M73 - Test Method for Extracting Relevant Characteristics from Measured Wafer Edge Profiles StdTpc-Automated Material Handling Systems SEMI M31-0306 (technical revision)

SEMI M31-0306 (technical revision)

support equipment

2  Knowledge of these characteristics can help the producer and consumer determine if the dimensional characteristics of a specimen wafer satisfy given geometrical requirements

The scope of this Specification is for one grade of n-butyl acetate used in the semiconductor industry

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M07300 - SEMI M73 - Test Method for Extracting Relevant Characteristics from Measured Wafer Edge Profiles StdTpc-Automated Material Handling Systems SEMI M31-0306 (technical revision)1 Purpose 1. 1 SEMI M1 specifies the contour of the shaped edge of silicon wafers by using templates that allow a wide variation in wafer edge profiles manufactured by silicon suppliers to still meet the specification. 1. 2 In many advanced wafer applications, a much tighter specification of the edge profile is required to control variations in subsequent circuit processing. These specifications frequently include values for certain characteristics