3D02200 - SEMI 3D22 - Guide on Measurements of Openings and Vias in Glass StdTpc-Documentation/Training due to embrittlement of PET)

due to embrittlement of PET) and external (e

SEMI E122-0217 (Reapproved 0623)

注意：本安全基準中以「註」為標題的段落並非正式內容，不得以此修改或取代正式的安全基準。

if it exists

背景および動機付け

3D02200 - SEMI 3D22 - Guide on Measurements of Openings and Vias in Glass StdTpc-Documentation/Training due to embrittlement of PET)1 Purpose 1. 1 Through glass vias is an emerging technology in the semiconductor industry. Definitions for openings in glass have been described in SEMI 3D11, and a specification for glass as substrate for semiconductor applications with or without openings has been laid out in SEMI 3D16. However, there are few or no agreed upon test methods for measuring the physical and dimensional properties of through glass vias or other openings in glass or the